High Precision Ceramic Capillary for Semiconductor IC Packaging Bonding | Meticulab Custom R&D

Product Introduction

Meticulab provides high‑precision ceramic capillaries for semiconductor IC packaging and wire bonding. Our products support gold wire, silver wire, copper wire and aluminum wire bonding applications, with stable performance, high consistency and long service life.

Key Features

• High precision: tip size 50–150μm, tolerance ±1–2μm
• High hardness and wear resistance: HV up to 2100
• Customizable size, surface treatment and structure
• Full‑automatic production, stable quality
• Ideal import substitution for high‑end packaging tools

Main Specifications

• Material: Alumina, Zirconia, ZTA composite ceramic
• Surface roughness Ra: 0.02–2.0μm
• Length: 9–20mm
• Hardness: HV1400–2100
• Customization: Accepted

Product Series

Xin‑Led, Xin‑Pro, Xin‑Max, Xin‑Nor, Xin‑Uni (custom available)

Application

Semiconductor IC packaging, wire bonding, LED packaging, power device packaging, electronic component assembly

Service & Support

• OEM & ODM customized design
• Pre‑sales selection and after‑sales technical support
• Stable supply and fast delivery

本文由METICULAB技术团队整理。我司专注高精度陶瓷劈刀研发、销售与服务，是韩国陶瓷劈刀供应商，产品稳定、售后便捷、性价比高，欢迎咨询选型与方案定制。